ABF potassium permanganate desmear

ABF potassium permanganate desmear
ABF potassium permanganate desmear

ABF potassium permanganate desmear, The present invention provides a desmear solution and a desmear method using the desmear solution. The desmear solution can form a plating film that is excellent in adhesion without overly roughening the surface of the resin substrate and can remove a smear inside a non-through hole formed in a resin substrate.

The desmear solution used in the current invention has an alkali metal hydroxide concentration of 0.2 to 0.4 mol/L, a permanganate concentration of 0.2 to 0.4 mol/L, and a molar concentration ratio of 1:5 to 1:20 between the two.

The current invention relates to a desmear solution, a desmear method, and more particularly, to a desmear solution for etching a resin substrate in a desmear treatment for printed circuit boards and a desmear process employing said desmear solution.

ABF potassium permanganate desmear Continues…

Based on JP Patent Application 2011-207031, submitted in Japan on September 22, 2011, the current Application claims priority rights. The entire disclosure of the Senior Filing Date Patent Application shall be incorporated into this Application by reference.
History of the Invention

A smear, or resin debris, is produced when a through-hole or a via hole is formed in a printed circuit board by heat created by friction between a drill, a laser, or something similar and the resin of the substrate of the printed circuit board. The smear produced inside the through-hole or via hole must be eliminated to maintain an electrical property. Hence a desmear treatment for stopping the spot by a chemical method has typically been used.

The most popular desmear process uses a permanganate, such as sodium permanganate or potassium permanganate, and an acidic compound in a chemical solution called the desmear solution. In particular, a treatment solution containing around 0.4 mol/L of permanganate and roughly 1N of caustic composite has been widely employed as the desmear solution consisting of these two substances (For example, refer to Patent Literature 1).

Ordinary desmear treatments aim to remove a smear that has formed inside a through-hole or a via hole in a resin substrate while suitably etching the resin substrate’s surface to create a preset surface roughness. In other words, it was necessary to improve the peel strength of a plating film formed on a resin substrate to enhance the adhesion of the plating film, as well as to remove a smear caused by the formation of a through-hole or a via hole to maintain an electrical property of a printed circuit board.

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